Patent Assignment
Reel/Frame 019826/0316
Assignment of Assignor's Interest
Recorded: 2007-09-14
Pages: 3
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Multiple-Dies Semiconductor Device with Redistributed Layer Pads