Assignment of Assignor's Interest

Recorded: 2007-09-14 Pages: 6

Assignors

YU, CHEEMEN

Executed: 2007-09-11

LIAO, CHIH-CHIN

Executed: 2007-09-03

TAKIAR, HEM

Executed: 2007-09-11

Assignee

SANDISK CORPORATION

601 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035

Covered Property (1)

Method of Forming a Semiconductor Die Having a Sloped Edge for Receiving an Electrical Connector

Application: 11/853,428 →

Publication: US 2009/0065902

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.