IP Library › Assignment 019869/0757
Patent Assignment
Reel/Frame 019869/0757

Assignment of Assignor's Interest

Recorded: 2007-09-25 Pages: 5
Assignors
CHUNG-LONG-SHAN, LAVAL
Executed: 2007-09-19
TANKONGCHUMRUSKUL, KIANGKAI
Executed: 2007-09-19
SILVERBROOK, KIA
Executed: 2007-09-19
Assignee
SILVERBROOK RESEARCH PTY LTD
393 DARLING STREET, BALMAIN, 2041, AUSTRALIA
Covered Property (1)
Method of Reducing Wire Bond Profile Height in Integrated Circuits Mounted to Circuit Boards
Patent: 7,988,033 →
Application: 11/860,539 →
Publication: US 2009/0081832
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 3, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028483/0085 →
Change of Name Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →