Patent Assignment
Reel/Frame 019882/0460
Assignment of Assignor's Interest
Recorded: 2007-09-17
Pages: 3
Assignor
YAEGASHI, HIROYUKI
Executed: 2007-08-31
Assignee
FUJIFILM CORPORATION
26-30, NISHIAZABU 2-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method of manufacturing flexible substrate for electronic device, method of manufacturing electronic device and electronic device manufactured thereby
Application:
11/898,891 →
Publication:
US 2009/0061233
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.