IP Library Assignment 019884/0846
Patent Assignment
Reel/Frame 019884/0846

Assignment of Assignor's Interest

Recorded: 2007-09-14 Pages: 4
Assignors
DEGENKOLB, THOMAS A.
Executed: 2007-08-30
BRANDENBURG, SCOTT D.
Executed: 2007-08-30
MANDEL, LARRY M.
Executed: 2007-08-30
CHOW, KIN YEAN
Executed: 2007-08-31
FANG, CHING MENG
Executed: 2007-08-31
YONG, SIM SING
Executed: 2007-08-31
Assignee
DELPHI TECHNOLOGIES, INC.
LEGAL STAFF - MAIL CODE: 480-410-202, P.O. BOX 5052, TROY, MICHIGAN
Covered Property (1)
Wrap-Around Overmold for Electronic Assembly
Patent: 7,616,448 →
Application: 11/901,042 →
Publication: US 2009/0073663
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 23, 2018
From: DELPHI TECHNOLOGIES, INC
To: DELPHI TECHNOLOGIES IP LIMITED
Reel/Frame 045113/0958 →
Change of Name Sep 18, 2024
From: DELPHI TECHNOLOGIES IP LIMITED
To: BORGWARNER US TECHNOLOGIES LLC
Reel/Frame 068985/0968 →