Patent Assignment
Reel/Frame 019888/0303
Assignment of Assignor's Interest
Recorded: 2007-09-27
Received: 2007-09-27
Pages: 2
Assignors
ECHIGO, FUMIO
Executed: 2007-03-20
HIRAI, SHOGO
Executed: 2007-03-20
NAKAMURA, TADASHI
Executed: 2007-03-20
SUGAWA, TOSHIO
Executed: 2007-03-20
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, JPX, 571-8501, JAPAN
Covered Property
(1)
Multilayer Printed Wiring Board and Method of Manufacturing the Same
Application:
11/577,957 →