IP Library Assignment 019924/0489
Patent Assignment
Reel/Frame 019924/0489

Assignment of Assignor's Interest

Recorded: 2007-10-05 Pages: 2
Assignors
MITSUMOTO, MASARU
Executed: 2007-06-25
WATANABE, SHIGEO
Executed: 2007-06-25
KUNIHIRO, TATSUHITO
Executed: 2007-06-25
Assignee
HITACHI PLANT TECHNOLOGIES, LTD.
5-2, HIGASHI-IKEBUKURO, 4-CHOUME, TOKUSHIMA-SHI, TOKYO, JAPAN
Covered Property (1)
Substrate Laminating Apparatus
Patent: 8,393,370 →
Application: 11/782,014 →
Publication: US 2008/0017322
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Coversheet to Correct the Assignees' Address That Was Previously Recorded on Reel 019924, Frame 0489. Nov 6, 2007
From: MITSUMOTO, MASARU; WATANABE, SHIGEO; KUNIHIRO, TATSUHITO
To: HITACHI PLANT TECHNOLOGIES, LTD.
Reel/Frame 020107/0180 →
Merger Mar 4, 2014
From: HITACHI PLANT TECHNOLOGIES, LTD.
To: HITACHI, LTD.
Reel/Frame 032384/0877 →