Patent Assignment
Reel/Frame 019935/0119
Assignment of Assignor's Interest
Recorded: 2007-10-09
Pages: 2
Assignor
SHIZUNO, YOSHINORI
Executed: 2007-05-14
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, 105-8460, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device That Includes Mounting Chip on Board and Sealing with Two Resins
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.