IP Library Assignment 019956/0564
Patent Assignment
Reel/Frame 019956/0564

Assignment of Assignor's Interest

Recorded: 2007-09-28 Pages: 2
Assignors
BRANDENBURG, SCOTT D.
Executed: 2007-09-18
LAUDICK, DAVID A.
Executed: 2007-09-18
Assignee
DELPHI TECHNOLOGIES, INC.
LEGAL STAFF- MAIL CODE: 480-410-202, P.O. BOX 5052, TROY, MICHIGAN
Covered Property (1)
Method of Overmolding an Electronic Assembly Having an Insert-Molded Vertical Mount Connector Header
Patent: 7,603,770 →
Application: 11/906,024 →
Publication: US 2009/0085248
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 23, 2018
From: DELPHI TECHNOLOGIES, INC
To: DELPHI TECHNOLOGIES IP LIMITED
Reel/Frame 045113/0958 →
Change of Name Sep 18, 2024
From: DELPHI TECHNOLOGIES IP LIMITED
To: BORGWARNER US TECHNOLOGIES LLC
Reel/Frame 068985/0968 →