Patent Assignment
Reel/Frame 019963/0627
Assignment of Assignor's Interest
Recorded: 2007-10-15
Pages: 2
Assignor
FORMOSA, KEVIN
Executed: 2007-09-27
Assignee
STMICROELECTRONICS LTD.
INDUSTRY ROAD, KIRKOP, ZRQ 10, MALTA
Covered Property
(1)
Removable Wafer Expander for Die Bonding Equipment
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.