Patent Assignment
Reel/Frame 019963/0673
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2007-10-15
Received: 2007-10-15
Pages: 5
Assignors
KANG, TAEWOO
Executed: 2007-08-30
KIM, KYUNGOE
Executed: 2007-08-30
PENDSE, RAJENDRA D.
Executed: 2007-10-11
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application
(1)
SOLDER JOINT FLIP CHIP INTERCONNECTION HAVING RELIEF STRUCTURE
App. No. 11/640,534
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