Patent Assignment
Reel/Frame 019963/0927
Assignment of Assignor's Interest
Recorded: 2007-10-15
Pages: 11
Assignors
AIMI, MARCO FRANCESCO
Executed: 2007-10-10
KAPUSTA, CHRISTOPHER JAMES
Executed: 2007-10-11
GOWDA, ARUN VIRUPAKSHA
Executed: 2007-10-15
HAYS, DAVID CECIL
Executed: 2007-10-11
BOOMHOWER, OLIVER CHARLES
Executed: 2007-10-15
CLAYDON, GLENN SCOTT
Executed: 2007-10-10
IANNOTTI, JOSEPH ALFRED
Executed: 2007-10-11
KEIMEL, CHRISTOPHER FRED
Executed: 2007-10-11
Assignee
GENERAL ELECTRIC COMPANY
1 RIVER ROAD, SCHENECTADY, NEW YORK, 12345
Covered Property
(1)
Sealed Wafer Packaging of Microelectromechanical Systems
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 20, 2025
From: DOLBY INTELLECTUAL PROPERTY LICENSING, LLC
To: EDISON INNOVATIONS, LLC
Reel/Frame 070293/0273 →
Assignment of Assignor's Interest
Mar 26, 2025
From: GENERAL ELECTRIC COMPANY
To: GE INTELLECTUAL PROPERTY LICENSING, LLC
Reel/Frame 070636/0815 →
Change of Name
Mar 26, 2025
From: GE INTELLECTUAL PROPERTY LICENSING, LLC
To: DOLBY INTELLECTUAL PROPERTY LICENSING, LLC
Reel/Frame 070643/0907 →