IP Library Assignment 019972/0898
Patent Assignment
Reel/Frame 019972/0898

Assignment of Assignor's Interest

Recorded: 2007-10-03 Pages: 2
Assignor
TANAKA, YASUO
Executed: 2007-05-28
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, 105-8460, JAPAN
Covered Property (1)
Grinding Machine Having Grinder Head and Method of Manufacturing Semiconductor Device by Using the Grinding Machine
Patent: 7,601,051 →
Application: 11/905,743 →
Publication: US 2008/0139090
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 22, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022162/0669 →
Change of Name Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →