Patent Assignment
Reel/Frame 019987/0375
Assignment of Assignor's Interest
Recorded: 2007-10-19
Pages: 5
Assignors
BAEK, BUM-GEE
Executed: 2003-07-28
CHOI, KWON-YOUNG
Executed: 2003-07-28
RHEE, YOUNG-JOON
Executed: 2003-07-28
KANG, BONG-JOO
Executed: 2003-07-28
LIM, SEUNG-TAEK
Executed: 2003-07-28
KONG, HYANG-SHIK
Executed: 2003-07-28
KIM, WON-JOO
Executed: 2003-07-28
Assignee
SAMSUNG ELECTRONICS CO. LTD
416, MAETAN-DONG, PALDAL-KU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Contact Structure of Semiconductor Device, Manufacturing Method Thereof, Thin Film Transistor Array Panel Including Contact Structure, and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.