IP Library › Assignment 020017/0976
Patent Assignment
Reel/Frame 020017/0976

Assignment of Assignor's Interest

Recorded: 2007-10-26 Pages: 3
Assignors
LIN, MOU-SHIUNG
Executed: 2007-10-19
LEE, JIN-YUAN
Executed: 2007-10-20
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD.,, HSINCHU, 300, TAIWAN
Covered Property (1)
Post Passivation Interconnection Schemes on Top of Ic Chip
Patent: 7,915,161 →
Application: 11/856,080 →
Publication: US 2008/0045008
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →