Patent Assignment
Reel/Frame 020040/0299
Assignment of Assignor's Interest
Recorded: 2007-10-29
Pages: 2
Assignors
SUZUKI, KOICHI
Executed: 2007-10-05
KAWAMURA, HIROSHI
Executed: 2007-10-05
OHTA, HARUHIKO
Executed: 2007-10-05
ABE, YOSHIYUKI
Executed: 2007-10-05
Assignee
TOKYO UNIVERSITY OF SCIENCE EDUCATIONAL FOUNDATION ADMINISTRATIVE ORGANIZATION
3, KAGURAZAKA 1-CHOME, SHINJUKU-KU, TOKYO 162-8601, JAPAN
Covered Property
(1)
Boil Cooling Method, Boil Cooling Apparatus, Flow Channel Structure, and Applied Technology Field Thereof