Patent Assignment
Reel/Frame 020078/0607
Assignment of Assignor's Interest
Recorded: 2007-11-07
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Gate of Die and Mold, Die and Mold for Injection Molding, and Method of Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.