Patent Assignment
Reel/Frame 020078/0857
Assignment of Assignor's Interest
Recorded: 2007-11-06
Pages: 3
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Chip Package for Image Sensor and Method of Manufacturing the Same