Patent Assignment
Reel/Frame 020114/0030
Assignment of Assignor's Interest
Recorded: 2007-11-15
Received: 2007-11-15
Pages: 3
Assignors
HUANG, CHING-CHENG
Executed: 2001-01-28
LEE, JIN-YUAN
Executed: 2001-01-28
LIN, MOU-SHIUNG
Executed: 2001-01-28
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD.,, HSINCHU, TWX, 300, TAIWAN
Covered Property
(1)
Low fabrication cost, fine pitch and high reliability solder bump
Application:
11/930,149 →