Patent Assignment
Reel/Frame 020114/0036
Assignment of Assignor's Interest
Recorded: 2007-11-15
Pages: 3
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD.,, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method for Fabricating Thermal Compliant Semiconductor Chip Wiring Structure for Chip Scale Packaging
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.