IP Library › Assignment 020126/0022
Patent Assignment
Reel/Frame 020126/0022

Assignment of Assignor's Interest

Recorded: 2007-11-15 Pages: 4
Assignors
LEE, JIN-YUAN
Executed: 2001-08-01
LEI, MING-TA
Executed: 2001-08-01
HUANG, CHING-CHENG
Executed: 2001-08-01
LIN, CHUEN-JYE
Executed: 2001-08-01
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD.,, HSINCHU, 300, TAIWAN
Covered Property (1)
Low Fabrication Cost, High Performance, High Reliability Chip Scale Package
Patent: 9,369,175 →
Application: 11/930,213 →
Publication: US 2008/0111236
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →