IP Library Assignment 020135/0123
Patent Assignment
Reel/Frame 020135/0123

Assignment of Assignor's Interest

Recorded: 2007-11-19 Pages: 3
Assignors
BORA, MUMTAZ Y.
Executed: 2007-11-16
GIRARDOT II, CHARLES E.
Executed: 2007-11-15
Assignee
KYOCERA WIRELESS CORP.
10300 CAMPUS POINT DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property (1)
Reliable Printed Wiring Board Assembly Employing Packages with Solder Joints and Related Assembly Technique
Application: 11/938,727 →
Publication: US 2008/0064139
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 31, 2010
From: KYOCERA WIRELESS CORP.
To: KYOCERA CORPORATION
Reel/Frame 024170/0005 →