IP Library › Assignment 020144/0797
Patent Assignment
Reel/Frame 020144/0797

Assignment of Assignor's Interest

Recorded: 2007-11-21 Pages: 4
Assignors
HIRANO, KOICHI
Executed: 2006-10-04
KARASHIMA, SEIJI
Executed: 2006-10-04
ICHIRYU, TAKASHI
Executed: 2006-10-04
TOMITA, YOSHIHIRO
Executed: 2006-10-04
NAKATANI, SEIICHI
Executed: 2006-10-04
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property (1)
Flip-Chip Mounting Method and Bump Formation Method
Patent: 7,927,997 →
Application: 11/579,299 →
Publication: US 2007/0243664
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 24, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0671 →