Patent Assignment
Reel/Frame 020176/0246
Assignment of Assignor's Interest
Recorded: 2007-11-29
Pages: 4
Assignors
ALVARADO, REYNANTE
Executed: 2007-11-26
LU, YUAN
Executed: 2007-10-08
REDBURN, RICHARD
Executed: 2007-10-08
Assignee
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DRIVE, PHOENIX, ARIZONA, 85034
Covered Property
(1)
Solder Bump Interconnect for Improved Mechanical and Thermo-Mechanical Performance
Application:
60/913,337 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.