Patent Assignment
Reel/Frame 020181/0768
Assignment of Assignor's Interest
Recorded: 2007-11-30
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Package, Printed Circuit Board Assembly Including the Same and Manufacturing Methods Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.