IP Library › Assignment 020192/0393
Patent Assignment
Reel/Frame 020192/0393

Assignment of Assignor's Interest

Recorded: 2007-12-04 Pages: 8
Assignors
HULL, CHARLES W.
Executed: 2007-11-09
PARTANEN, JOUNI
Executed: 2007-11-27
SOLIZ, RAY
Executed: 2007-11-28
PAPPAS, WILLIAM J.
Executed: 2007-11-28
MOJDEH, MEHDI
Executed: 2007-11-26
Assignee
3D SYSTEMS, INC.
333 THREE D SYSTEMS CIRCLE, ROCK HILL, SOUTH CAROLINA, 29730
Covered Property (1)
Method for Removing Excess Uncured Build Material in Solid Imaging
Patent: 7,731,887 →
Application: 11/856,405 →
Publication: US 2008/0171284
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Feb 27, 2019
From: 3D SYSTEMS, INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 048456/0017 →
Release of Security Interest Aug 26, 2021
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: 3D SYSTEMS, INC.
Reel/Frame 057651/0374 →