Patent Assignment
Reel/Frame 020194/0188
Assignment of Assignor's Interest
Recorded: 2007-11-21
Pages: 3
Assignors
KIM, YEON-HEE
Executed: 2007-11-08
LEE, JUNG-HYUN
Executed: 2007-11-08
PARK, YONG-YOUNG
Executed: 2007-11-08
LEE, CHANG-SOO
Executed: 2007-11-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Thin Film Etching Method