Patent Assignment
Reel/Frame 020203/0155
Assignment of Assignor's Interest
Recorded: 2007-11-28
Pages: 4
Assignor
MORITA, TAKAAKI
Executed: 2007-11-06
Assignee
TDK CORPORATION
1-13-1, NIHONBASHI, CHUO-KU, TOKYO, 103-8272, JAPAN
Covered Property
(1)
Collective Mounting Method of Electronic Components and Manufacturing Method of Electronic Component -Embedded Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.