IP Library Assignment 020205/0007
Patent Assignment
Reel/Frame 020205/0007

Assignment of Assignor's Interest

Recorded: 2007-12-06 Pages: 3
Assignors
LEE, KEUN-HYUK
Executed: 2007-12-06
LIM, SEUNG-WON
Executed: 2007-12-06
Assignee
FAIRCHILD KOREA SEMICONDUCTOR, LTD.
(420-711) 82-3 DODANG-DONG WOMNI-GU, WONMI DISTRICT, BUCHEON-SI, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property (1)
High Power Semiconductor Package and Method of Making the Same
Patent: 7,714,428 →
Application: 11/951,634 →
Publication: US 2008/0136015
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 2, 2017
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044361/0205 →
Patent Security Agreement Nov 17, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 044481/0541 →
Release of Security Interest in Patents Recorded at Reel 04481, Frame 0541 Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064072/0459 →