Patent Assignment
Reel/Frame 020206/0741
Security Agreement
Recorded: 2007-12-07
Pages: 8
Assignor
MEMSCAP S.A.
Executed: 2007-08-31
Assignee
SOCIETE GENERALE, S.A.
29 BOULEVARD HAUSSMANN, PARIS, FRANCE
Covered Properties
(2)
Dielectric Links for Microelectromechanical Systems
Patent:
6,268,635 →
Application:
09/366,933 →
Switches and Switching Arrays That Use Microelectromechanical Devices Having One or More Beam Members That Are Responsive to Temperature