Patent Assignment
Reel/Frame 020260/0188
Assignment of Assignor's Interest
Recorded: 2007-12-18
Pages: 2
Assignors
HASEBE, AKIO
Executed: 2007-08-07
MOTOYAMA, YASUHIRO
Executed: 2007-08-07
NARIZUKA, YASUNORI
Executed: 2007-08-21
NAKAMURA, SEIGO
Executed: 2007-08-07
KAWAKAMI, KENJI
Executed: 2007-08-23
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Integrated Circuit Device and a Method of Manufacturing a Thin Film Probe Sheet for Using the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024864/0635 →
Merger
Aug 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0190 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Assignment of Assignor's Interest
Aug 29, 2025
From: VITESCO TECHNOLOGIES GMBH
To: SCHAEFFLER TECHNOLOGIES AG & CO. KG
Reel/Frame 072774/0843 →