Patent Assignment
Reel/Frame 020262/0550
Assignment of Assignor's Interest
Recorded: 2007-12-18
Pages: 3
Assignor
HARA, TOSHIKI
Executed: 2007-10-22
Assignee
SEIKO EPSON CORPORATION
4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0811, JAPAN
Covered Property
(1)
A Method for Manufacturing a Wiring Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.