Patent Assignment
Reel/Frame 020281/0383
Assignment of Assignor's Interest
Recorded: 2007-12-21
Pages: 4
Assignors
KRUEGER, OLAF
Executed: 2007-12-10
SCHOENE, GERD
Executed: 2007-12-11
JOHN, WILFRED
Executed: 2007-12-11
WERNICKE, TIM
Executed: 2007-12-11
WUERFL, JOACHIM
Executed: 2007-11-30
Assignee
FORSCHUNGSVERBUND BERLIN E.V.
RUDOWER CHAUSSEE 17, BERLIN, 12489, GERMANY
Covered Property
(1)
Method for Producing Through-Contacts in Semi-Conductor Wafers via Production of Through-Plated Holes
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.