Patent Assignment
Reel/Frame 020323/0734
Assignment of Assignor's Interest
Recorded: 2008-01-07
Pages: 4
Assignors
TOKUNAGA, SHINYA
Executed: 2007-05-28
ITO, MITSUMI
Executed: 2007-05-28
IWANISHI, NOBUFUSA
Executed: 2007-05-28
SEKO, KOICHI
Executed: 2007-05-28
SUZUKI, HIROAKI
Executed: 2007-05-29
TANAKA, HIROYUKI
Executed: 2007-05-29
NISHIMURA, YUICHI
Executed: 2007-05-30
FUJIMOTO, KAZUHIKO
Executed: 2007-05-28
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Method of Designing Semiconductor Integrated Circuit, Designing Apparatus, Semiconductor Integrated Circuit System, Semiconductor Integrated Circuit Mounting Substrate, Package and Semiconductor Integrated Circuit
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.