Patent Assignment
Reel/Frame 020334/0253
Assignment of Assignor's Interest
Recorded: 2008-01-08
Pages: 4
Assignors
SON, JOON-SEO
Executed: 2007-12-27
JEON, O-SEOB
Executed: 2007-12-27
LEE, TAEK-KEUN
Executed: 2007-12-27
LEE, BYOUNG-OK
Executed: 2007-12-27
Assignee
FAIRCHILD KOREA SEMICONDUCTOR, LTD.
82-3, DODANG-DONG, WOMNI-GU, GYEONGGI-DO, BUCHEON SI, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property
(1)
Power Device Package Comprising Metal Tab Die Attach Paddle (Dap) and Method of Fabricating the Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 2, 2017
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044361/0205 →
Patent Security Agreement
Nov 17, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 044481/0541 →
Release of Security Interest in Patents Recorded at Reel 04481, Frame 0541
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064072/0459 →