IP Library › Assignment 020342/0588
Patent Assignment
Reel/Frame 020342/0588

Assignment of Assignor's Interest

Recorded: 2008-01-09 Pages: 2
Assignors
SAKAI, TADAHIKO
Executed: 2007-05-22
MAEDA, TADASHI
Executed: 2007-05-22
OZONO, MITSURU
Executed: 2007-05-22
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property (1)
Method for Soldering Electronic Component and Soldering Structure of Electronic Component
Patent: 7,632,710 →
Application: 11/817,522 →
Publication: US 2009/0233117
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 11, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021818/0725 →
Assignment of Assignor's Interest Nov 10, 2014
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 034194/0143 →
Corrective Assignment to Correct the Erroneously Filed Application Numbers 13/384239, 13/498734, 14/116681 and 14/301144 Previously Recorded on Reel 034194 Frame 0143. Assignor(S) Hereby Confirms the Assignment. Dec 24, 2020
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 056788/0362 →