Patent Assignment
Reel/Frame 020348/0041
Assignment of Assignor's Interest
Recorded: 2008-01-10
Pages: 2
Assignors
ITO, TETSUO
Executed: 2007-05-29
YOSHIDA, TAKAYUKI
Executed: 2007-05-29
FUKUDA, TOSHIYUKI
Executed: 2007-05-29
OCHI, TAKAO
Executed: 2007-05-29
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Production Equipment of Resin Molding Semiconductor Device, Method of Manufacturing Resin Molding Semiconductor Device, and Resin Molding Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.