Assignment of Assignor's Interest

Recorded: 2008-01-17 Received: 2008-01-17 Pages: 4

Assignors

GRIFFIN, HUGH J.

Executed: 2008-01-10

MACNAMARA, CORMAC

Executed: 2008-01-10

WILSON, ROBIN

Executed: 2008-01-10

Assignee

ICEMOS TECHNOLOGY CORPORATION

P.O. BOX 24619, TEMPE, AZ, 85284, UNITED STATES

Covered Property (1)

Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric Shape

Application: 11/925,329 →