Patent Assignment
Reel/Frame 020379/0611
Assignment of Assignor's Interest
Recorded: 2008-01-17
Pages: 3
Assignee
BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
NO. 8 XIHUANZHONGLU, BDA, BEIJING, 100176, CHINA
Covered Property
(1)
Tape for Semiconductor Package and Cutting Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.