Patent Assignment
Reel/Frame 020398/0624
Assignment of Assignor's Interest
Recorded: 2008-01-22
Pages: 2
Assignor
TAKAHASHI, YOSHIKAZU
Executed: 2008-01-21
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, 105-8460, JAPAN
Covered Property
(1)
Semiconductor Chip on Film Package with Dummy Patterns and Manufacturing Method Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.