Patent Assignment
Reel/Frame 020400/0880
Assignment of Assignor's Interest
Recorded: 2008-01-15
Received: 2008-01-22
Pages: 2
Assignor
LAUFFER, JOHN M
Executed: 2008-01-03
Assignee
ENDICOTT INTERCONNECT TECHNOLOGIES, INC
1095 CLARK STREET, ENDICOTT, NY, 13760, UNITED STATES
Covered Property
(1)
Method of making circuitized assembly including a plurality of circuitized substrates
Application:
12/007,704 →