Patent Assignment
Reel/Frame 020408/0537
Assignment of Assignor's Interest
Recorded: 2008-01-16
Pages: 4
Assignee
TDK CORPORATION
1-13-1, NIHONBASHI, CHUO-KU, TOKYO 103-8272, JAPAN
Covered Property
(1)
Wiring structure, forming method of the same and printed wiring board
Application:
12/007,830 →
Publication:
US 2008/0202803
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.