IP Library Assignment 020410/0949
Patent Assignment
Reel/Frame 020410/0949

Assignment of Assignor's Interest

Recorded: 2007-12-21 Pages: 4
Assignors
YOSHIDA, IORI
Executed: 2007-10-22
KON, YOSHINORI
Executed: 2007-10-22
Assignees
ASAHI GLASS COMPANY, LIMITED
12-1, YURAKUCHO 1-CHOME, CHIYODA-KU, TOKYO, 100-8405, JAPAN
AGC SEIMI CHEMICAL CO., LTD.
2-10, CHIGASAKI 3-CHOME, CHIGASAKI-CITY, KANAGAWA, 253-8585, JAPAN
Covered Property (1)
Polishing Compound for Semiconductor Integrated Circuit Device, Polishing Method and Method for Producing Semiconductor Integrated Circuit Device
Patent: 7,695,345 →
Application: 11/863,852 →
Publication: US 2008/0085663
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 7, 2018
From: ASAHI GLASS COMPANY, LIMITED
To: AGC INC.
Reel/Frame 046730/0786 →