Patent Assignment
Reel/Frame 020416/0422
Assignment of Assignor's Interest
Recorded: 2008-01-25
Pages: 5
Assignee
OHSHIN MLP CO., LTD.
14-23, YAHANASHI-CHO, ECHIZEN-SHI, FUKUI, 915-0052, JAPAN
Covered Property
(1)
Kit Comprising Exothermic Structure and at Least Two Pressure Sensitive Adhesive Structures
Application:
12/019,998 →
Publication:
US 2009/0188614
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.