Patent Assignment
Reel/Frame 020419/0673
Assignment of Assignor's Interest
Recorded: 2008-01-09
Pages: 3
Assignor
JUNG, JUNG HWA
Executed: 2008-01-03
Assignee
SEOUL SEMICONDUCTOR CO., LTD.
148-29 GASAN-DONG, GEUMCHEON-GU, SEOUL, 153-801, KOREA, REPUBLIC OF
Covered Property
(1)
Mold for Forming a Molding Member and Method of Fabricating a Molding Member Using the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.