Patent Assignment
Reel/Frame 020467/0643
Assignment of Assignor's Interest
Recorded: 2008-02-05
Pages: 5
Assignors
JENG, SHIN-PUU
Executed: 2008-02-04
LIU, YU-WEN
Executed: 2008-02-04
TSAI, HAO-YI
Executed: 2008-02-04
CHEN, HSIEN-WEI
Executed: 2008-02-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bond Pad Structure