Patent Assignment
Reel/Frame 020500/0411
Assignment of Assignor's Interest
Recorded: 2008-01-28
Pages: 3
Assignors
CHANG, SHU-MING
Executed: 2007-10-19
KUO, TZU-YING
Executed: 2007-11-06
CHIANG, CHIA-WEN
Executed: 2007-11-06
CHANG, HSIANG-HUNG
Executed: 2007-11-07
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195. SEC. 4, CHUNG HSING RD., CHUTUNG, HSINCHU, ROC 31040, TAIWAN
Covered Property
(1)
Image Sensor Module with a Three-Dimensional Die-Stacking Structure