Patent Assignment
Reel/Frame 020510/0396
Assignment of Assignor's Interest
Recorded: 2008-02-14
Pages: 7
Assignors
DUNN, GREGOY J
Executed: 2008-01-28
CROSWELL, ROBERT T
Executed: 2008-01-28
CHELINI, REMY J
Executed: 2008-01-29
Assignee
MOTOROLA, INC.
1303 E. ALGONQUIN ROAD, SCHAUMBURG, ILLINOIS, 60196
Covered Property
(1)
Thin Solid Electrolytic Capacitor Embeddable in a Substrate
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 14, 2008
From: PRYMAK, JOHN D.; STOLARSKI, CHRIS; JACOBS, DAVID; WAYNE, CHRIS
To: KEMET ELECTRONICS CORPORATION
Reel/Frame 020510/0321 →
Security Agreement
Jul 1, 2009
From: KEMET CORPORATION
To: K FINANCING, LLC
Reel/Frame 022892/0795 →
Release of Security Interest Recorded at Reel/Frame 022892/0795
May 18, 2010
From: K FINANCING, LLC
To: KEMET CORPORATION
Reel/Frame 024397/0774 →
Security Interest
Oct 5, 2010
From: KEMET ELECTRONICS CORPORATION
To: BANK OF AMERICA, N.A. AS AGENT
Reel/Frame 025150/0023 →
Change of Name
Mar 14, 2011
From: MOTOROLA, INC.
To: MOTOROLA SOLUTIONS, INC.
Reel/Frame 025946/0074 →
Security Agreement
May 22, 2017
From: KEMET CORPORATION; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 042523/0639 →
Release of Security Interest
Nov 8, 2018
From: BANK OF AMERICA, N.A.
To: KEMET CORPORATION,; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
Reel/Frame 047450/0926 →