Patent Assignment
Reel/Frame 020534/0097
Assignment of Assignor's Interest
Recorded: 2008-02-07
Pages: 4
Assignor
SEKO, TOSHIHARU
Executed: 2005-03-17
Assignee
SHARP KABUSHIKI KAISHA
22-22 NAGAIKE-CHO ABENO-KU, OSAKA-SHI, OSAKA, 545-8522, JAPAN
Covered Property
(1)
Semiconductor Apparatus, Manufacturing Method Thereof, Semiconductor Module Apparatus Using Semiconductor Apparatus, and Wire Substrate for Semiconductor Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.