Patent Assignment
Reel/Frame 020534/0323
Assignment of Assignor's Interest
Recorded: 2008-02-20
Pages: 4
Assignors
KATO, YUTAKA
Executed: 2007-08-28
SUZUKI, HIROAKI
Executed: 2007-08-28
UEDA, NAOTO
Executed: 2007-08-28
AOKURA, ISAMU
Executed: 2007-08-28
YOSHIDA, TAKAYUKI
Executed: 2007-08-28
MOTOFUJI, TAKUMA
Executed: 2007-08-28
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Semiconductor device including a heat conductor having an opening therein
Application:
11/898,502 →
Publication:
US 2008/0099891
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.